StencilQuik™, previously honored with the coveted Vison Award for Product of the Year under the Rework Products category, is now a standard procedure in IPC 7711 5.7.2
StencilQuik features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs. It allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.
For more details visit us at Solder.net.
BGA placement bga rework repair bga rework process reworking bga
On December 23 2014 at Illinois, United States 2 Views