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StencilQuik - BGA Rework Process | BEST, Inc

StencilQuik™, previously honored with the coveted Vison Award for Product of the Year under the Rework Products category, is now a standard procedure in IPC 7711 5.7.2

StencilQuik features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs. It allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.

For more details visit us at Solder.net.

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On December 23 2014 at Illinois, United States 2 Views

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